Photoelectric Sensors | Canada

In TAB processes where LSI and flexible circuit boards (TAB tape) are bonded, the protective film is removed from the TAB tape before bonding. When the film is removed, the film may rip due to abnormal tension, etc. To prevent the machine from continuously producing defective products, the sensor plays an important role in this process to detect whether the film is infallibly removed and stops the machine in case of an error. However, transparent films are not easy to detect. Most machine manufacturers usually use high performance ultrasonic sensors to ensure accuracy. Although general-purpose photoelectric sensors can be used in order to reduce cost, the question of detection performance remains. TAB machine designers may have issues in responding to the needs of manufacturing floors to keep equipment costs down while improving performance at the same time.

Photoelectric sensors that reliably detect transparent films
In this case, IDEC proposes the use of SA1E-X miniature photoelectric switches that can detect transparent objects stably. The sensor can unfailingly detect transparent objects without being affected by angles, vibration, dents, and deflections of films due to its coaxial optical structure and small beam spot. If the removed protective film is continuously detected, the sensor can immediately detect interruption due to breaking of the film and stop the equipment at the same time.
Now that the photoelectric sensor can be used for this kind of difficult task in detecting transparent objects, the cost can be kept down compared with ultrasonic sensors. Our SA1E-X miniature photoelectric switches are ideal for use in TAB equipment.

With unprecedented performance compared to conventional photoelectric sensors, the SA1E-X can be used in a wide variety of applications
IDEC SA1E-X miniature photoelectric switches differ from most general photoelectric sensors which have a non-coaxial structure, which means they do not have a blind zone that cannot be detected. As objects near the sensor can be detected, it can be used in small equipment and where space is limited. While it can detect a long distance of up to 2m, the response speed is fast, at 500μ seconds. It can be used in a wide variety of designs and applications, and not limited to LSI manufacturing equipment. If you have any questions or would like to know more about other uses, please contact IDEC.